HY-1350SP High Speed Slitting Machine


Specification Values
Substrate Paper, Paper laminated and other aseptic package
Substrate thickness 120 ~ 600g/㎡
Slitting width 1350mm
Slitting speed 400m/min
Max. unwind diameter Φ 800mm 
Max. rewind diameter Φ 1500mm
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HY-1800SA Lamination Film Slitter


Specification Values
Substrate Pre-coated film
Substrate thickness 12 ~ 100μm
Unwinding width 1800mm
Slitting speed 300m/min
Max. unwind diameter Φ800mm 
Max. rewind diameter Φ500mm
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